FR4 TG170 HDI PCB Board 3mil Immersion Gold Lead Free Pcb OEM ODM
HDI PCB Board HDI Circuit Boards Rohs PCB PCB And PCBA FR4 PCB Board PCB Printed Circuit Board Assembly
6L 1+N+1 HDI PCB
High-density interconnect (HDI) PCBs are characterized by finer lines, closer spaces, and more dense wiring. They have a faster connection while reducing the size of a project. Normally, these boards also feature blind and buried vias, laser ablated microvias, sequential lamination, and via in-pads. A HDI board can house the functionality of the previous boards used.
HDI Board Stack-up:
1+N+1 with laser microvia and mechanical buried core via. The “1” represents “build-up” or sequential lamination on each side of the core.
i+N+i (i>=2) PCBs contain 2 or more “build-up” of high-density interconnect layers. Microvias on different layers can be staggered or stacked. Copper filled stacked microvia structures are commonly seen in challenging designs.
HSX products cover 1~32L FR-4 PCB, IMS PCB,HDI Boards, high frequency PTFE boards and Rigid-flex boards etc. It provides flexible quick turn production services (12 hours to72 hours), as well as small volume to big volume PCB manufacturing.Products are widely used in high-tech fields such as communications, power supplies, computer networks, digital products, industrial control, science and education, medical devices, and aerospace.
| PCB Layer | 6L | PCB material | FR4 TG170 |
| Copper thickness | 3/3/3/3/3/3oz | PCB thickness | 2.0MM |
| Min. hole size | 0.15mm | Min.PCB track/gap: | 3mil |
| PCB solder mask | Black | PCB silkscreen | White |
| PCB surface finished | Immersion Gold | PCB outline | Routing |
| Application | power supplies |
| Special requirement: | Heavy copper 3OZ/small line space and gap:3/3mil/HDI Buried vias and blind vias, one step stack up /min |
FAQ:
1. What service can you provide?
PCB Manufacture,PCB Assembly,Rapid Prototype
2. How fast is your lead time?
Fastest 24H for 2L and 4L, 3WDs for HDI board.
3. How to get quick quotation?
Please provide gerber file and details of the board(including layer, board thickness, copper thickness, surface treatment, solder mask and silkscreen color, special request if any, demand quantity, etc)
sample:
| PCB Layer | 6L |
| PCB surface | IMMERSION GOLD |
| PCB material | FR4, TG170 |
| Copper thickness | 3/3/3/3/3/3oz finished |
| PCB solder mask | Double side, Black |
| PCB silkscreen | Double side,White |
| Special requirement | Heavy copper 3OZ/small line space and gap:3/3mil |
4.What payment terms do you have?
Wire Transfer(T/T)
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FR4 TG170 HDI PCB Board 3mil Immersion Gold Lead Free Pcb OEM ODM Images
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